Cheng Xu

Person

Lawrenceville, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 12,154,715
- Issue date Nov 26, 2024
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 12,087,746
- Issue date Sep 10, 2024
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,901,115
- Issue date Feb 13, 2024
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic structures in integrated circuit package supports
- Patent number 11,830,809
- Issue date Nov 28, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base resistance cancellation method and related methods, systems, a...
- Patent number 11,768,115
- Issue date Sep 26, 2023
- Microchip Technology Incorporated
- Hyunsoo Yeom
- G01 - MEASURING TESTING
Information Patent Grant
Dual trace thickness for single layer routing
- Patent number 11,769,719
- Issue date Sep 26, 2023
- Intel Corporation
- Jonathan Rosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,735,537
- Issue date Aug 22, 2023
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,721,677
- Issue date Aug 8, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for package substrates
- Patent number 11,705,389
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,696,407
- Issue date Jul 4, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors
- Patent number 11,651,885
- Issue date May 16, 2023
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a lateral trace
- Patent number 11,646,254
- Issue date May 9, 2023
- Tahoe Research, LTD.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,557,579
- Issue date Jan 17, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity structures in integrated circuit package supports
- Patent number 11,557,489
- Issue date Jan 17, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a cooling channel
- Patent number 11,521,914
- Issue date Dec 6, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solution based deposition of dielectrics for advanced s...
- Patent number 11,508,636
- Issue date Nov 22, 2022
- Intel Corporation
- Andrew Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Effective heat conduction from hotspot to heat spreader through pac...
- Patent number 11,502,017
- Issue date Nov 15, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,482,471
- Issue date Oct 25, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 11,450,471
- Issue date Sep 20, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,443,892
- Issue date Sep 13, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,417,614
- Issue date Aug 16, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for extension of operation voltage
- Patent number 11,404,539
- Issue date Aug 2, 2022
- NXP USA, INC.
- Xin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material in substrate cavity
- Patent number 11,387,224
- Issue date Jul 12, 2022
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,380,609
- Issue date Jul 5, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding magnetic material, in a cored or coreless semiconductor p...
- Patent number 11,355,459
- Issue date Jun 7, 2022
- INTEL CORPOATION
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor structures for package devices
- Patent number 11,335,632
- Issue date May 17, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for an inductor at a first level interface
- Patent number 11,322,290
- Issue date May 3, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,246,218
- Issue date Feb 8, 2022
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Galvanic corrosion protection for semiconductor packages
- Patent number 11,217,534
- Issue date Jan 4, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20240405006
- Publication date Dec 5, 2024
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED MECHANICAL STRESS RESISTANCE
- Publication number 20240204113
- Publication date Jun 20, 2024
- NXP B.V.
- Saumitra Raj Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYCRYSTALLINE SEMICONDUCTOR RESISTOR
- Publication number 20230395646
- Publication date Dec 7, 2023
- NXP USA, Inc.
- Ronghua Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
- Publication number 20230369192
- Publication date Nov 16, 2023
- Intel Corporation
- Jonathan ROSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20230352385
- Publication date Nov 2, 2023
- Tahoe Research, Ltd.
- Yikang DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20230238368
- Publication date Jul 27, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR ON A GLASS SUBSTRATE
- Publication number 20230197351
- Publication date Jun 22, 2023
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
- Publication number 20230187205
- Publication date Jun 15, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...
- Publication number 20220367104
- Publication date Nov 17, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE
- Publication number 20220359115
- Publication date Nov 10, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...
- Publication number 20220328431
- Publication date Oct 13, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
- Publication number 20220278038
- Publication date Sep 1, 2022
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
- Publication number 20220230800
- Publication date Jul 21, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20220230951
- Publication date Jul 21, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...
- Publication number 20220117089
- Publication date Apr 14, 2022
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Extension of Operation Voltage
- Publication number 20220069077
- Publication date Mar 3, 2022
- NXP USA, Inc.
- Xin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE RESISTANCE CANCELLATION METHOD AND RELATED METHODS, SYSTEMS, A...
- Publication number 20220057273
- Publication date Feb 24, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Hyunsoo Yeom
- G01 - MEASURING TESTING
Information Patent Application
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20210305154
- Publication date Sep 30, 2021
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20210111166
- Publication date Apr 15, 2021
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20210020558
- Publication date Jan 21, 2021
- Intel Corporation
- Yikang DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR AN ELECTRONIC DEVICE
- Publication number 20200411413
- Publication date Dec 31, 2020
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200402884
- Publication date Dec 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS FOR PACKAGE SUBSTRATES
- Publication number 20200395282
- Publication date Dec 17, 2020
- Intel Corporation
- Andrew J. BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
- Publication number 20200373257
- Publication date Nov 26, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LDMOS WITH DIODE COUPLED ISOLATION RING
- Publication number 20200328304
- Publication date Oct 15, 2020
- NXP USA, Inc.
- Xin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...
- Publication number 20200312738
- Publication date Oct 1, 2020
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200273776
- Publication date Aug 27, 2020
- Intel Corporation
- Cheng Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GALVANIC CORROSION PROTECTION FOR SEMICONDUCTOR PACKAGES
- Publication number 20200266149
- Publication date Aug 20, 2020
- Intel Corporation
- Cheng XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...
- Publication number 20200251467
- Publication date Aug 6, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL
- Publication number 20200211927
- Publication date Jul 2, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods to selectively embed magnetic materials in substrate and co...

Microelectronic assemblies having an integrated capacitor

Substrate assembly with encapsulated magnetic feature

Vented lids for integrated circuit packages

Magnetic structures in integrated circuit package supports

Base resistance cancellation method and related methods, systems, a...

Dual trace thickness for single layer routing

Methods to embed magnetic material as first layer on coreless subst...

Microelectronic assemblies having an integrated capacitor

Vias for package substrates

Core layer with fully encapsulated co-axial magnetic material aroun...

Magnetic core inductors

Electronic device including a lateral trace

Microelectronic assemblies having an integrated capacitor

Cavity structures in integrated circuit package supports

Microelectronic assemblies having a cooling channel

Multi-layer solution based deposition of dielectrics for advanced s...

Effective heat conduction from hotspot to heat spreader through pac...

Thermal management solutions for integrated circuit packages

Methods to selectively embed magnetic materials in substrate and co...

Substrate assembly with encapsulated magnetic feature

Methods to embed magnetic material as first layer on coreless subst...

Apparatus for extension of operation voltage

Phase change material in substrate cavity

Microelectronic assemblies having conductive structures with differ...

Embedding magnetic material, in a cored or coreless semiconductor p...

Magnetic inductor structures for package devices

Techniques for an inductor at a first level interface

Core layer with fully encapsulated co-axial magnetic material aroun...

Galvanic corrosion protection for semiconductor packages

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

SEMICONDUCTOR DEVICE WITH IMPROVED MECHANICAL STRESS RESISTANCE

POLYCRYSTALLINE SEMICONDUCTOR RESISTOR

DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

FILM CAPACITOR ON A GLASS SUBSTRATE

SUBSTRATE PACKAGE WITH GLASS DIELECTRIC

METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...

SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE

METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...

TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...

Apparatus for Extension of Operation Voltage

BASE RESISTANCE CANCELLATION METHOD AND RELATED METHODS, SYSTEMS, A...

MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

SUBSTRATE FOR AN ELECTRONIC DEVICE

VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES

VIAS FOR PACKAGE SUBSTRATES

TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE

LDMOS WITH DIODE COUPLED ISOLATION RING

THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

GALVANIC CORROSION PROTECTION FOR SEMICONDUCTOR PACKAGES

PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...

MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL