Cheng-Yang SU

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Hukou Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Coplanar bump contacts of differing sizes
- Patent number 11,887,958
- Issue date Jan 30, 2024
- STMicroelectronics Ltd.
- Cheng-Yang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a sidewall connection
- Patent number 11,749,627
- Issue date Sep 5, 2023
- STMicroelectronics Ltd.
- Endruw Jahja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a sidewall connection
- Patent number 11,195,809
- Issue date Dec 7, 2021
- STMicroelectronics Ltd.
- Endruw Jahja
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPLANAR BUMP CONTACTS OF DIFFERING SIZES
- Publication number 20220059486
- Publication date Feb 24, 2022
- STMicroelectronics LTD
- Cheng-Yang SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SIDEWALL CONNECTION
- Publication number 20220051998
- Publication date Feb 17, 2022
- STMICROELECTRONICS LTD.
- Endruw JAHJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SIDEWALL CONNECTION
- Publication number 20200211988
- Publication date Jul 2, 2020
- STMICROELECTRONICS LTD.
- Endruw JAHJA
- H01 - BASIC ELECTRIC ELEMENTS