CHENG YANG

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Wuxi City, CN

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250105224
- Publication date Mar 27, 2025
- JCET Management Co., Ltd.
- Cheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250096176
- Publication date Mar 20, 2025
- JCET Management Co., Ltd.
- Cheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC COUPLING-BASED INTER-CHIP WIRELESS COMMUNICATION INTERFACE...
- Publication number 20240171209
- Publication date May 23, 2024
- ZHEJIANG UNIVERSITY
- Xiaolei Zhu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INDUCTIVE COUPLING SYSTEM AND METHOD FOR ADAPTIVE CONTROL OF POWER...
- Publication number 20240162751
- Publication date May 16, 2024
- ZHEJIANG UNIVERSITY
- Xiaolei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170267
- Publication date Jun 1, 2023
- JCET MANAGEMENT CO., LTD.
- CHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170274
- Publication date Jun 1, 2023
- JCET MANAGEMENT CO., LTD.
- CHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS