Cheng-Yi Hong

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,855,066
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device package
- Patent number 11,508,710
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,335,672
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,741,537
- Issue date Aug 11, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING COOMPANY LTD.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semicondcutor device package
- Patent number 10,714,463
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semicondcutor device package
- Patent number 10,504,880
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of forming semiconductor de...
- Patent number 10,276,551
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming encapsulated semiconductor device package
- Patent number 9,502,323
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method
- Patent number 8,941,248
- Issue date Jan 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088124
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220271024
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200357785
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE
- Publication number 20200286878
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE
- Publication number 20200098739
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE
- Publication number 20190252363
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR DEVICE PACKAGE AND METHOD OF FORMING SEMICONDCUTOR DE...
- Publication number 20190006341
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180204828
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method
- Publication number 20150123257
- Publication date May 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method
- Publication number 20140264813
- Publication date Sep 18, 2014
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Cheng-Yi Hong

Person

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Method of forming semiconductor device package

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Method of forming semicondcutor device package

Method of forming semicondcutor device package

Semiconductor device package and method of forming semiconductor de...

Method of forming encapsulated semiconductor device package

Semiconductor device package and method

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

SEMICONDCUTOR DEVICE PACKAGE AND METHOD OF FORMING SEMICONDCUTOR DE...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Package and Method

Semiconductor Device Package and Method