CHENG-YU WANG

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Patents Applicationslast 30 patents

Information Patent Application
LIQUID COOLING VAPOR CHAMBER HEAT DISSIPATION MODULE
- Publication number 20250003696
- Publication date Jan 2, 2025
- TOP RANK TECHNOLOGY LIMITED
- TIEN-LAI WANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTEGRATED HEAT DISSIPATION MODULE STRUCTURE
- Publication number 20240298425
- Publication date Sep 5, 2024
- TOP RANK TECHNOLOGY LIMITED
- TIEN-LAI WANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTEGRATED VAPOR CHAMBER
- Publication number 20240240873
- Publication date Jul 18, 2024
- TOP RANK TECHNOLOGY LIMITED
- TIEN-LAI WANG
- F28 - HEAT EXCHANGE IN GENERAL