Cheng-Yuan KUNG

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure
- Patent number 12,218,075
- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,051,658
- Issue date Jul 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,935,841
- Issue date Mar 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,923,825
- Issue date Mar 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure and package structure
- Patent number 11,798,890
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,784,111
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure including shielding layer contactin...
- Patent number 11,756,896
- Issue date Sep 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System comprising packaged optical devices
- Patent number 11,722,220
- Issue date Aug 8, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device package
- Patent number 11,594,660
- Issue date Feb 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor bank structure and semiconductor package structure
- Patent number 11,545,427
- Issue date Jan 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,508,668
- Issue date Nov 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,502,067
- Issue date Nov 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,348,885
- Issue date May 31, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,296,043
- Issue date Apr 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure and package structure
- Patent number 11,233,010
- Issue date Jan 25, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor process
- Patent number 11,201,125
- Issue date Dec 14, 2021
- Advanced Semiconductor Engineering, Inc.
- Sheng-Chi Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device assembly structure and method of manufacturing the same
- Patent number 11,189,604
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Chao-Kai Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,037,846
- Issue date Jun 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System comprising packaged optical devices
- Patent number 10,903,907
- Issue date Jan 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electrical device
- Patent number 10,490,341
- Issue date Nov 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,475,734
- Issue date Nov 12, 2019
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device package and method for manufacturing the same
- Patent number 10,472,228
- Issue date Nov 12, 2019
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package comprising a dielectric layer with bui...
- Patent number 10,475,718
- Issue date Nov 12, 2019
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,211,137
- Issue date Feb 19, 2019
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413061
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371711
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND PACKAGE STRUCTURE INCLUDING THE SAME
- Publication number 20240373752
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ting CHEN
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240304584
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hai-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240304555
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hung-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240215151
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Chiang SHIH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES
- Publication number 20230420395
- Publication date Dec 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM COMPRISING PACKAGED OPTICAL DEVICES
- Publication number 20230403078
- Publication date Dec 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu LIN
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230326889
- Publication date Oct 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Hung-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230326861
- Publication date Oct 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Hung-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230215822
- Publication date Jul 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230215816
- Publication date Jul 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230207729
- Publication date Jun 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230077877
- Publication date Mar 16, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230078564
- Publication date Mar 16, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230075336
- Publication date Mar 9, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230065615
- Publication date Mar 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230024293
- Publication date Jan 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220384309
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220293538
- Publication date Sep 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220181267
- Publication date Jun 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220181268
- Publication date Jun 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220157709
- Publication date May 19, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Chiang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20220148974
- Publication date May 12, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210280744
- Publication date Sep 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210202409
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20210202392
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210175189
- Publication date Jun 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM COMPRISING PACKAGED OPTICAL DEVICES
- Publication number 20210167856
- Publication date Jun 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu LIN
- G02 - OPTICS
Information Patent Application
DEVICE ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210111165
- Publication date Apr 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Chao-Kai HUNG
- H01 - BASIC ELECTRIC ELEMENTS

Cheng-Yuan KUNG

Person

Patents Grantslast 30 patents

Package structure

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Assembly structure and package structure

Semiconductor device and method for manufacturing the same

Semiconductor package structure including shielding layer contactin...

System comprising packaged optical devices

Semiconductor device package

Capacitor bank structure and semiconductor package structure

Semiconductor package structure and method for manufacturing the same

Package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Assembly structure and package structure

Semiconductor package and semiconductor process

Device assembly structure and method of manufacturing the same

Semiconductor package structure and method of manufacturing the same

System comprising packaged optical devices

Electrical device

Semiconductor device package

MEMS device package and method for manufacturing the same

Semiconductor device package comprising a dielectric layer with bui...

Semiconductor device package

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

PACKAGE STRUCTURE

SEMICONDUCTOR SUBSTRATE AND PACKAGE STRUCTURE INCLUDING THE SAME

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICES

SYSTEM COMPRISING PACKAGED OPTICAL DEVICES

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

PHOTONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ASSEMBLY STRUCTURE AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ASSEMBLY STRUCTURE AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SYSTEM COMPRISING PACKAGED OPTICAL DEVICES

DEVICE ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME