Chengtar WU

Person

Jiangyin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional chip packaging structure and method thereof
- Patent number 11,735,564
- Issue date Aug 22, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including antenna
- Patent number 11,728,558
- Issue date Aug 15, 2023
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,699,840
- Issue date Jul 11, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna packaging module and making method thereof
- Patent number 11,626,657
- Issue date Apr 11, 2023
- HAUWEI DEVICE CO., LTD
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,515,269
- Issue date Nov 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method for antenna
- Patent number 11,502,392
- Issue date Nov 15, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,488,915
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing same
- Patent number 11,462,403
- Issue date Oct 4, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Jiashan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna feeder package structure and packaging method
- Patent number 11,437,707
- Issue date Sep 6, 2022
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens antenna packaging structure, preparation method and electronic...
- Patent number 11,322,852
- Issue date May 3, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,316,247
- Issue date Apr 26, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna packaging structure and method for forming the same
- Patent number 11,316,252
- Issue date Apr 26, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna package structure and packaging method
- Patent number 11,302,658
- Issue date Apr 12, 2022
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and packaging method
- Patent number 11,289,435
- Issue date Mar 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,289,793
- Issue date Mar 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,283,152
- Issue date Mar 22, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation method thereof
- Patent number 11,257,772
- Issue date Feb 22, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,228,087
- Issue date Jan 18, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna packaging module and making method thereof
- Patent number 11,228,089
- Issue date Jan 18, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor structure with an antenna module
- Patent number 11,211,687
- Issue date Dec 28, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having antenna module
- Patent number 11,133,568
- Issue date Sep 28, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 11,114,391
- Issue date Sep 7, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having antenna module
- Patent number 10,916,829
- Issue date Feb 9, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method for antenna
- Patent number 10,886,594
- Issue date Jan 5, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation thereof
- Patent number 10,886,243
- Issue date Jan 5, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation method thereof
- Patent number 10,872,867
- Issue date Dec 22, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna packaging structure and preparation method thereof
- Patent number 10,872,868
- Issue date Dec 22, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package structure and antenna packaging method
- Patent number 10,854,951
- Issue date Dec 1, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor vertical wire bonding structure and method
- Patent number 10,854,476
- Issue date Dec 1, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out antenna package structure and packaging method
- Patent number 10,804,229
- Issue date Oct 13, 2020
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20220102837
- Publication date Mar 31, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH AN ANTENNA AND METHOD MAKING THE SAME
- Publication number 20220077567
- Publication date Mar 10, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220076951
- Publication date Mar 10, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Jiashan YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210391637
- Publication date Dec 16, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Chengtar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20210249370
- Publication date Aug 12, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL SIP MODULE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20210202338
- Publication date Jul 1, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Chengtar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS ANTENNA PACKAGING STRUCTURE, PREPARATION METHOD AND ELECTRONIC...
- Publication number 20210203078
- Publication date Jul 1, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Jangshen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Chip Packaging Structure And Method Thereof
- Publication number 20210175210
- Publication date Jun 10, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Packaging Method for Antenna
- Publication number 20210083362
- Publication date Mar 18, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Packaging Module And Making Method Thereof
- Publication number 20210066784
- Publication date Mar 4, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Chengtar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Packaging Module and Making Method Thereof
- Publication number 20210066783
- Publication date Mar 4, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Chengtar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20210036406
- Publication date Feb 4, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20200411456
- Publication date Dec 31, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Feeder Package Structure and Packaging Method
- Publication number 20200411948
- Publication date Dec 31, 2020
- SJ Semiconductor(Jiangyin) Corporation
- Jangshen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20200373263
- Publication date Nov 26, 2020
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20200373262
- Publication date Nov 26, 2020
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION THEREOF
- Publication number 20200075515
- Publication date Mar 5, 2020
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20200058604
- Publication date Feb 20, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Antenna Package Structure And Packaging Method
- Publication number 20200058605
- Publication date Feb 20, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Vertical Wire Bonding Structure And Method
- Publication number 20200043889
- Publication date Feb 6, 2020
- SJ Semiconductor(Jiangyin) Corporation
- Han HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Package Structure And Antenna Packaging Method
- Publication number 20190348380
- Publication date Nov 14, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20190333881
- Publication date Oct 31, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20190333879
- Publication date Oct 31, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20190333880
- Publication date Oct 31, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20190288373
- Publication date Sep 19, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure And Packaging Method For Antenna
- Publication number 20190288370
- Publication date Sep 19, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD
- Publication number 20190288372
- Publication date Sep 19, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA FEEDER PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20190288374
- Publication date Sep 19, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Jangshen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE
- Publication number 20190181534
- Publication date Jun 13, 2019
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE
- Publication number 20190181535
- Publication date Jun 13, 2019
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Chengtar WU

Person

Patents Grantslast 30 patents

Three-dimensional chip packaging structure and method thereof

Semiconductor structure including antenna

Antenna package structure and antenna packaging method

Antenna packaging module and making method thereof

Semiconductor packaging structure having antenna module

Packaging structure and packaging method for antenna

Antenna package structure and antenna packaging method

Semiconductor structure and method for manufacturing same

Antenna feeder package structure and packaging method

Lens antenna packaging structure, preparation method and electronic...

Semiconductor packaging structure having antenna module

Antenna packaging structure and method for forming the same

Fan-out antenna package structure and packaging method

Fan-out antenna packaging structure and packaging method

Semiconductor packaging structure having antenna module

Antenna package structure and antenna packaging method

Fan-out antenna packaging structure and preparation method thereof

Antenna package structure and antenna packaging method

Antenna packaging module and making method thereof

Method of fabricating a semiconductor structure with an antenna module

Semiconductor package structure having antenna module

Antenna package structure and antenna packaging method

Semiconductor package structure having antenna module

Packaging structure and packaging method for antenna

Fan-out antenna packaging structure and preparation thereof

Fan-out antenna packaging structure and preparation method thereof

Fan-out antenna packaging structure and preparation method thereof

Antenna package structure and antenna packaging method

Semiconductor vertical wire bonding structure and method

Fan-out antenna package structure and packaging method

Patents Applicationslast 30 patents

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

SEMICONDUCTOR STRUCTURE WITH AN ANTENNA AND METHOD MAKING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

ANTENNA PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

WAFER-LEVEL SIP MODULE STRUCTURE AND METHOD FOR PREPARING THE SAME

LENS ANTENNA PACKAGING STRUCTURE, PREPARATION METHOD AND ELECTRONIC...

Three-Dimensional Chip Packaging Structure And Method Thereof

Packaging Structure and Packaging Method for Antenna

Antenna Packaging Module And Making Method Thereof

Antenna Packaging Module and Making Method Thereof

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

FAN-OUT ANTENNA PACKAGE STRUCTURE AND PACKAGING METHOD

Antenna Feeder Package Structure and Packaging Method

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PACKAGING METHOD

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION THEREOF

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PACKAGING METHOD

Fan-Out Antenna Package Structure And Packaging Method

Semiconductor Vertical Wire Bonding Structure And Method

Antenna Package Structure And Antenna Packaging Method

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

Packaging Structure And Packaging Method For Antenna

ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD

ANTENNA FEEDER PACKAGE STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE

SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE