Chengyan Liu

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
Package in package (PiP) electronic device and manufacturing method...
- Patent number 9,397,068
- Issue date Jul 19, 2016
- Beijing University of Technology
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FCOC (Flip Chip On Chip) package and manufacturing method thereof
- Patent number 8,951,840
- Issue date Feb 10, 2015
- Beijing University of Technology
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package in Package (PiP) Electronic Device and Manufacturing Method...
- Publication number 20150348934
- Publication date Dec 3, 2015
- BEIJING UNIVERSITY OF TECHNOLOGY
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FCoC (Flip Chip on Chip) Package and Manufacturing Method thereof
- Publication number 20140302640
- Publication date Oct 9, 2014
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS