CHENYE HE

Person

Wuxi City, Jiangsu Province, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure having a plurality of chips attached to a lead fr...
- Patent number 11,854,949
- Issue date Dec 26, 2023
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335882
- Publication date Oct 19, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230275039
- Publication date Aug 31, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187366
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187363
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187422
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220399254
- Publication date Dec 15, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGE METHOD FOR CAVITY DEVICE GROUP
- Publication number 20220223574
- Publication date Jul 14, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package structure having a plurality of chips attached to a lead fr...

Patents Applicationslast 30 patents

ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

PACKAGE STRUCTURE AND PACKAGE METHOD FOR CAVITY DEVICE GROUP