Cheol Ho Joh

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package on which semiconductor chip is mounted on sub...
- Patent number 9,490,187
- Issue date Nov 8, 2016
- SK hynix Inc.
- Cheol Ho Joh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and method for manufacturing the same
- Patent number 9,305,912
- Issue date Apr 5, 2016
- SK Hynix Inc.
- Hee Min Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package and method for manufacturing the same
- Patent number 9,165,899
- Issue date Oct 20, 2015
- SK Hynix Inc.
- Cheol Ho Joh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including semiconductor chips having protrus...
- Patent number 9,093,441
- Issue date Jul 28, 2015
- SK Hynix Inc.
- Ji Eun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and method for manufacturing the same
- Patent number 9,082,634
- Issue date Jul 14, 2015
- SK Hynix Inc.
- Hee-Min Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming interconnection line using screen printing tech...
- Patent number 8,951,810
- Issue date Feb 10, 2015
- SK hynix Inc.
- Kyu Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing chip package
- Patent number 8,822,271
- Issue date Sep 2, 2014
- SK Hynix Inc.
- Cheol Ho Joh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip unit and stack package having the same
- Patent number 8,564,141
- Issue date Oct 22, 2013
- SK Hynix Inc.
- Kyu Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and method for manufacturing the same
- Patent number 8,476,751
- Issue date Jul 2, 2013
- SK Hynix Inc.
- Kyu Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package and method for manufacturing the same
- Patent number 7,859,108
- Issue date Dec 28, 2010
- Hynix Semiconductor Inc.
- Woong Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor package that prevents damage to semiconductor...
- Patent number 7,705,468
- Issue date Apr 27, 2010
- Hynix Semiconductor Inc.
- Cheol Ho Joh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING SIDE SHIELDING PARTS
- Publication number 20170162516
- Publication date Jun 8, 2017
- SK HYNIX INC.
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ON WHICH SEMICONDUCTOR CHIP IS MOUNTED ON SUB...
- Publication number 20150279758
- Publication date Oct 1, 2015
- SK HYNIX INC.
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150270252
- Publication date Sep 24, 2015
- SK HYNIX INC.
- Hee Min SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150008580
- Publication date Jan 8, 2015
- SK HYNIX INC.
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING SEMICONDUCTOR CHIPS HAVING PROTRUS...
- Publication number 20140175638
- Publication date Jun 26, 2014
- SK HYNIX INC.
- Ji Eun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE
- Publication number 20140170812
- Publication date Jun 19, 2014
- SK HYNIX INC.
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING INTERCONNECTION LINE USING SCREEN PRINTING TECH...
- Publication number 20140057369
- Publication date Feb 27, 2014
- SK HYNIX INC.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130256887
- Publication date Oct 3, 2013
- SK HYNIX INC.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120018879
- Publication date Jan 26, 2012
- Hynix Semiconductor Inc.
- Hee Min SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP UNIT AND STACK PACKAGE HAVING THE SAME
- Publication number 20110272798
- Publication date Nov 10, 2011
- Hynix Semiconductor Inc.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110272820
- Publication date Nov 10, 2011
- Hynix Semiconductor Inc.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING TH...
- Publication number 20110189928
- Publication date Aug 4, 2011
- Hynix Semiconductor Inc.
- Hee Min SHIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING TH...
- Publication number 20100092718
- Publication date Apr 15, 2010
- Hee Min SHIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090140426
- Publication date Jun 4, 2009
- Woong Sun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE THAT PREVENTS DAMAGE TO SEMICONDUCTOR...
- Publication number 20090096075
- Publication date Apr 16, 2009
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC SHIELDING PART
- Publication number 20080061406
- Publication date Mar 13, 2008
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-stacked package
- Publication number 20040262773
- Publication date Dec 30, 2004
- Cheol Ho Joh
- H01 - BASIC ELECTRIC ELEMENTS

Cheol Ho Joh

Person

Patents Grantslast 30 patents

Semiconductor package on which semiconductor chip is mounted on sub...

Stack package and method for manufacturing the same

Stacked package and method for manufacturing the same

Semiconductor packages including semiconductor chips having protrus...

Stack package and method for manufacturing the same

Methods for forming interconnection line using screen printing tech...

Method and apparatus for manufacturing chip package

Chip unit and stack package having the same

Stacked semiconductor package and method for manufacturing the same

Flip chip package and method for manufacturing the same

Stacked semiconductor package that prevents damage to semiconductor...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES INCLUDING SIDE SHIELDING PARTS

SEMICONDUCTOR PACKAGE ON WHICH SEMICONDUCTOR CHIP IS MOUNTED ON SUB...

STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACKED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES INCLUDING SEMICONDUCTOR CHIPS HAVING PROTRUS...

METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE

METHODS FOR FORMING INTERCONNECTION LINE USING SCREEN PRINTING TECH...

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP UNIT AND STACK PACKAGE HAVING THE SAME

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING TH...

WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING TH...

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACKED SEMICONDUCTOR PACKAGE THAT PREVENTS DAMAGE TO SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC SHIELDING PART

Chip-stacked package