Cheolsoo HAN

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,100,635
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BALL ATTACHING APPARATUS
- Publication number 20240071983
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240023346
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Younghun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220020656
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS