Cheong Chiang Ng

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Cheras, MY

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Patents Grantslast 30 patents

Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thermal dissipation lead frame
- Patent number 8,836,092
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chetan Verma
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package system using etched leadframe
- Patent number 8,163,604
- Issue date Apr 24, 2012
- Stats Chippac Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION LEAD FRAME
- Publication number 20140345117
- Publication date Nov 27, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chetan Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION LEAD FRAME
- Publication number 20140117521
- Publication date May 1, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chetan Verma
- H01 - BASIC ELECTRIC ELEMENTS