Cheonsoo HAN

Person

Nirasaki City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ruthenium wiring and manufacturing method thereof
- Patent number 10,522,467
- Issue date Dec 31, 2019
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma film-forming method and plasma film-forming apparatus
- Patent number 10,190,217
- Issue date Jan 29, 2019
- Tokyo Electron Limited
- Minoru Honda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper wiring forming method with Ru liner and Cu alloy fill
- Patent number 9,406,557
- Issue date Aug 2, 2016
- Tokyo Electron Limited
- Osamu Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 9,253,862
- Issue date Feb 2, 2016
- Tokyo Electron Limited
- Tatsuo Hirasawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MICROWAVE PLASMA SOURCE AND MICROWAVE PLASMA PROCESSING APPARATUS
- Publication number 20180127880
- Publication date May 10, 2018
- TOKYO ELECTRON LIMITED
- Koji Kotani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RUTHENIUM WIRING AND MANUFACTURING METHOD THEREOF
- Publication number 20180012844
- Publication date Jan 11, 2018
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA FILM-FORMING METHOD AND PLASMA FILM-FORMING APPARATUS
- Publication number 20170370000
- Publication date Dec 28, 2017
- TOKYO ELECTRON LIMITED
- Minoru Honda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper Wiring Forming Method
- Publication number 20150004784
- Publication date Jan 1, 2015
- TOKYO ELECTRON LIMITED
- Osamu YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20140090597
- Publication date Apr 3, 2014
- TOKYO ELECTRON LIMITED
- Tatsuo HIRASAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS AND CLEANING METHOD FOR REMOVING METAL...
- Publication number 20140060572
- Publication date Mar 6, 2014
- TOKYO ELECTRON LIMITED
- Chiaki YASUMURO
- H01 - BASIC ELECTRIC ELEMENTS

Cheonsoo HAN

Person

Patents Grantslast 30 patents

Ruthenium wiring and manufacturing method thereof

Plasma film-forming method and plasma film-forming apparatus

Copper wiring forming method with Ru liner and Cu alloy fill

Plasma processing method and plasma processing apparatus

Patents Applicationslast 30 patents

MICROWAVE PLASMA SOURCE AND MICROWAVE PLASMA PROCESSING APPARATUS

RUTHENIUM WIRING AND MANUFACTURING METHOD THEREOF

PLASMA FILM-FORMING METHOD AND PLASMA FILM-FORMING APPARATUS

Copper Wiring Forming Method

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS AND CLEANING METHOD FOR REMOVING METAL...