Chern-Yow Hsu

Person

Chu-Bei city, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Mask transfer method (and related apparatus) for a bumping process
- Patent number 12,132,039
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,133,470
- Issue date Oct 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CPMPANY, LTD.
- Harry-Hak-Lay Chuang
Information Patent Grant
Method for forming a hard mask with a tapered profile
- Patent number 12,114,576
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Yung Ko
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,087,826
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure and methods of forming the same
- Patent number 12,010,933
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,973,149
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask for MTJ patterning
- Patent number 11,943,934
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chern-Yow Hsu
Information Patent Grant
Magnetic tunnel junction device with residue-protection sidewall sp...
- Patent number 11,910,620
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chern-Yow Hsu
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,855,127
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Jen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement with capacitor
- Patent number 11,856,750
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic tunnel junction memory cell with a buffer-layer and method...
- Patent number 11,844,285
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure
- Patent number 11,839,161
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chern-Yow Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Bond pad with enhanced reliability
- Patent number 11,824,022
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,805,660
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with composite spacer
- Patent number 11,800,822
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fu-Ting Sung
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 11,785,861
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Ting Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a hard mask with a tapered profile
- Patent number 11,765,980
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Yung Ko
Information Patent Grant
Bump structure to prevent metal redeposit and to prevent bond pad c...
- Patent number 11,735,550
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask transfer method (and related apparatus) for a bumping process
- Patent number 11,721,683
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for MRAM MTJ top electrode connection
- Patent number 11,683,990
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,575,052
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,569,296
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,532,697
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Jen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a magnetic tunneling junction (MTJ)...
- Patent number 11,515,473
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask for MTJ patterning
- Patent number 11,508,782
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetoresistive random access memory cell and fabricating the same
- Patent number 11,502,245
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory device and manufacturing technology
- Patent number 11,495,743
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
VIA structure and methods of forming the same
- Patent number 11,489,115
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 11,476,337
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RRAM cell structure with conductive etch-stop layer
- Patent number 11,430,956
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240381666
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Harry-Hak-Lay CHUANG
Information Patent Application
BOND PAD WITH ENHANCED RELIABILITY
- Publication number 20240379594
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A HARD MASK WITH A TAPERED PROFILE
- Publication number 20240373755
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Yung Ko
Information Patent Application
VIA STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240334847
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARD MASK FOR MTJ PATTERNING
- Publication number 20240260277
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chern-Yow Hsu
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240234592
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSING CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240088206
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YI JEN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240023460
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-TING SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH COMPOSITE SPACER
- Publication number 20230380306
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Ting SUNG
Information Patent Application
BOND PAD WITH ENHANCED RELIABILITY
- Publication number 20230369260
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC TUNNEL JUNCTION MEMORY CELL WITH A BUFFER-LAYER AND METHOD...
- Publication number 20230371393
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow HSU
- G11 - INFORMATION STORAGE
Information Patent Application
BOTTOM ELECTRODE VIA AND CONDUCTIVE BARRIER DESIGN TO ELIMINATE ELE...
- Publication number 20230371397
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chern-Yow Hsu
Information Patent Application
METHOD FOR FORMING A HARD MASK WITH A TAPERED PROFILE
- Publication number 20230363285
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Yung Ko
Information Patent Application
MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS
- Publication number 20230335543
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR MRAM MTJ TOP ELECTRODE CONNECTION
- Publication number 20230276713
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230187563
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSING CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetoresistive Random Access Memory Cell And Fabricating The Same
- Publication number 20230072420
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chern-Yow Hsu
- G11 - INFORMATION STORAGE
Information Patent Application
Via Structure And Methods Of Forming The Same
- Publication number 20230059026
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE AND MANUFACTURING TECHNOLOGY
- Publication number 20220367811
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20220367646
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-WEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ELECTRODE VIA AND CONDUCTIVE BARRIER DESIGN TO ELIMINATE ELE...
- Publication number 20220352458
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220336575
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI JEN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL HARD MASK FOR MTJ PATTERNING
- Publication number 20220336529
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC TUNNEL JUNCTION DEVICE WITH RESIDUE-PROTECTION SIDEWALL SP...
- Publication number 20220285438
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHERN-YOW HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220216267
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHERN-YOW HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS
- Publication number 20220181312
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH ENHANCED RELIABILITY
- Publication number 20220157751
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH COMPOSITE SPACER
- Publication number 20220131072
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Ting SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC TUNNEL JUNCTION MEMORY CELL WITH A BUFFER-LAYER AND METHOD...
- Publication number 20220123203
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...
- Publication number 20220115349
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS

Chern-Yow Hsu

Person

Patents Grantslast 30 patents

Mask transfer method (and related apparatus) for a bumping process

Semiconductor structure and method of forming the same

Method for forming a hard mask with a tapered profile

Method for forming a semiconductor structure

Via structure and methods of forming the same

Semiconductor device and method of forming the same

Hard mask for MTJ patterning

Magnetic tunnel junction device with residue-protection sidewall sp...

Semiconductor structure and method for forming the same

Semiconductor arrangement with capacitor

Magnetic tunnel junction memory cell with a buffer-layer and method...

Semiconductor structure

Bond pad with enhanced reliability

Semiconductor structure

Memory device with composite spacer

Semiconductor structure and method of manufacturing the same

Method for forming a hard mask with a tapered profile

Bump structure to prevent metal redeposit and to prevent bond pad c...

Mask transfer method (and related apparatus) for a bumping process

Techniques for MRAM MTJ top electrode connection

Semiconductor device and method of forming the same

Semiconductor structure

Semiconductor structure and method for forming the same

Semiconductor device including a magnetic tunneling junction (MTJ)...

Hard mask for MTJ patterning

Magnetoresistive random access memory cell and fabricating the same

Non-volatile memory device and manufacturing technology

VIA structure and methods of forming the same

Method for forming a semiconductor structure

RRAM cell structure with conductive etch-stop layer

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

BOND PAD WITH ENHANCED RELIABILITY

METHOD FOR FORMING A HARD MASK WITH A TAPERED PROFILE

VIA STRUCTURE AND METHODS OF FORMING THE SAME

HARD MASK FOR MTJ PATTERNING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE WITH COMPOSITE SPACER

BOND PAD WITH ENHANCED RELIABILITY

MAGNETIC TUNNEL JUNCTION MEMORY CELL WITH A BUFFER-LAYER AND METHOD...

BOTTOM ELECTRODE VIA AND CONDUCTIVE BARRIER DESIGN TO ELIMINATE ELE...

METHOD FOR FORMING A HARD MASK WITH A TAPERED PROFILE

MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS

TECHNIQUES FOR MRAM MTJ TOP ELECTRODE CONNECTION

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Magnetoresistive Random Access Memory Cell And Fabricating The Same

Via Structure And Methods Of Forming The Same

NON-VOLATILE MEMORY DEVICE AND MANUFACTURING TECHNOLOGY

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

BOTTOM ELECTRODE VIA AND CONDUCTIVE BARRIER DESIGN TO ELIMINATE ELE...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

NOVEL HARD MASK FOR MTJ PATTERNING

MAGNETIC TUNNEL JUNCTION DEVICE WITH RESIDUE-PROTECTION SIDEWALL SP...

SEMICONDUCTOR STRUCTURE

MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS

BOND PAD WITH ENHANCED RELIABILITY

MEMORY DEVICE WITH COMPOSITE SPACER

MAGNETIC TUNNEL JUNCTION MEMORY CELL WITH A BUFFER-LAYER AND METHOD...

BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...