Cheryl Field

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Kildeer, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Microdevice assembly having a fine grain getter layer for maintaini...
- Patent number 6,867,543
- Issue date Mar 15, 2005
- Motorola, Inc.
- Joe P. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of separating and handling a thin semiconductor die on a wafer
- Patent number 6,772,509
- Issue date Aug 10, 2004
- Motorola, Inc.
- Shiuh-Hui Steven Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Microdevice assembly having a fine grain getter layer for maintaini...
- Publication number 20040189198
- Publication date Sep 30, 2004
- Joe P. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of separating and handling a thin semiconductor die on a wafer
- Publication number 20030140486
- Publication date Jul 31, 2003
- Shiuh-Hui Steven Chen
- G06 - COMPUTING CALCULATING COUNTING