TREA

Cheryl L. Tytran-Palomaki

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  • Endicott, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for forming a plated microvia interconnect
    • Patent number 7,328,506
    • Issue date Feb 12, 2008
    • International Business Machines Corporation
    • Miguel A. Jimarez
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Integrated circuit structure
    • Patent number 6,887,779
    • Issue date May 3, 2005
    • International Business Machines Corporation
    • David J. Alcoe
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Integrated circuit structure
    • Patent number 6,720,502
    • Issue date Apr 13, 2004
    • International Business Machine Corporation
    • David J. Alcoe
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    High density design for organic chip carriers
    • Patent number 6,538,213
    • Issue date Mar 25, 2003
    • International Business Machines Corporation
    • Timothy F. Carden
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laminate having plated microvia interconnects and method for formin...
    • Patent number 6,492,600
    • Issue date Dec 10, 2002
    • International Business Machines Corporation
    • Miguel A. Jimarez
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents