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Cheryl Palomaki
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Endicott, NY, US
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last 30 patents
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Patent Grant
Method of making a circuitized substrate with enhanced circuitry an...
Patent number
7,595,454
Issue date
Sep 29, 2009
Endicott Interconnect Technologies, Inc.
John S. Kresge
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Information handling system including a circuitized substrate havin...
Patent number
7,508,076
Issue date
Mar 24, 2009
Endicott Interconnect Technologies, Inc.
Robert Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate
Patent number
7,416,996
Issue date
Aug 26, 2008
Endicott Interconnect Technologies, Inc.
Robert Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuitized substrate
Patent number
7,078,816
Issue date
Jul 18, 2006
Endicott Interconnect Technologies, Inc.
Robert Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Filling open through holes in a multilayer board
Patent number
6,204,456
Issue date
Mar 20, 2001
International Business Machines Corporation
John M. Lauffer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES
Publication number
20120012553
Publication date
Jan 19, 2012
Endicott Interconnect Technologies, Inc.
Robert M. Japp
B32 - LAYERED PRODUCTS
Information
Patent Application
Method of making a circuitized substrate with enhanced circuitry an...
Publication number
20080098595
Publication date
May 1, 2008
Endicott Interconnect Technologies, Inc.
John S. Kresge
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making a circuitized substrate having a plurality of sold...
Publication number
20070090170
Publication date
Apr 26, 2007
Endicott Interconnect Technologies, Inc.
Steven W. Anderson
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making circuitized substrate
Publication number
20060131755
Publication date
Jun 22, 2006
Endicott Interconnect Technologies, Inc.
Robert Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Information handling system
Publication number
20060125103
Publication date
Jun 15, 2006
Endicott Interconnect Technologies, Inc.
Robert Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate, method of making same, electrical assembly u...
Publication number
20050224985
Publication date
Oct 13, 2005
Endicott Interconnect Technologies, Inc.
Robert Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR