Cheul-Joong Youn

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 8,053,881
- Issue date Nov 8, 2011
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of fabricating a semiconductor device by back...
- Patent number 7,495,315
- Issue date Feb 24, 2009
- Samsung Electronics Co., Ltd.
- Sang-Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of fabricating a semiconductor device by back...
- Patent number 7,323,397
- Issue date Jan 29, 2008
- Samsung Electronics Co., Ltd.
- Sang-Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped chip carrier package using lead frame and method for manufac...
- Patent number 6,984,877
- Issue date Jan 10, 2006
- Samsung Electronics Co., Ltd.
- Chan-Suk Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20110244634
- Publication date Oct 6, 2011
- Samsung Electronics Co., Ltd.
- Young-Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20100072593
- Publication date Mar 25, 2010
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20090309206
- Publication date Dec 17, 2009
- Samsung Electronics Co., Ltd.
- Young-Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, apparatus and method for manufacturing the s...
- Publication number 20090079052
- Publication date Mar 26, 2009
- Samsung Electronics Co., Ltd.
- Cheul-Joong Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level stacked package having via contact in encapsulation por...
- Publication number 20090014876
- Publication date Jan 15, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Cheul-joong Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR PACKAGE INCLUDING SEMICON...
- Publication number 20080308935
- Publication date Dec 18, 2008
- Samsung Electronics Co., Ltd.
- Young-Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of fabricating a semiconductor device by back...
- Publication number 20080086858
- Publication date Apr 17, 2008
- Sang-Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor chip package
- Publication number 20070007634
- Publication date Jan 11, 2007
- Cheul-Joong Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and method for manufacturing the same
- Publication number 20050242417
- Publication date Nov 3, 2005
- Cheul-Joong Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of fabricating a semiconductor device by back...
- Publication number 20050196939
- Publication date Sep 8, 2005
- Sang-Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumped chip carrier package using lead frame and method for manufac...
- Publication number 20050098861
- Publication date May 12, 2005
- Chan-Suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and stacked module having a functional p...
- Publication number 20050023659
- Publication date Feb 3, 2005
- Sang-Yeop Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cheul-Joong Youn

Person

Patents Grantslast 30 patents

Semiconductor package and method for manufacturing the same

Method and apparatus of fabricating a semiconductor device by back...

Method and apparatus of fabricating a semiconductor device by back...

Bumped chip carrier package using lead frame and method for manufac...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Semiconductor package and method for manufacturing the same

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Semiconductor package, apparatus and method for manufacturing the s...

Wafer level stacked package having via contact in encapsulation por...

SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR PACKAGE INCLUDING SEMICON...

Method and apparatus of fabricating a semiconductor device by back...

Method for manufacturing semiconductor chip package

Semiconductor chip package and method for manufacturing the same

Method and apparatus of fabricating a semiconductor device by back...

Bumped chip carrier package using lead frame and method for manufac...

Semiconductor chip package and stacked module having a functional p...