Chew Ching Lim

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Sungai Petani, MY

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate warpage reshaping apparatus and method
- Patent number 9,633,874
- Issue date Apr 25, 2017
- Altera Corporation
- Chew Ching Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with solderless interconnection structure
- Patent number 9,425,174
- Issue date Aug 23, 2016
- Altera Corporation
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS