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Patents Grantslast 30 patents

Information Patent Grant
Embedding additive particles in encapsulant of electronic device
- Patent number 9,852,918
- Issue date Dec 26, 2017
- Infineon Technologies AG
- Peh Hean Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded sensor package with an integrated magnet and method of manuf...
- Patent number 9,817,079
- Issue date Nov 14, 2017
- Infineon Technologies AG
- Choo Tian Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Primer composition, method of forming a primer layer on a semicondu...
- Patent number 9,540,539
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Embedding additive particles in encapsulant of electronic device
- Publication number 20160064298
- Publication date Mar 3, 2016
- INFINEON TECHNOLOGIES AG
- Peh Hean TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SENSOR PACKAGE WITH AN INTEGRATED MAGNET AND METHOD OF MANUF...
- Publication number 20160018476
- Publication date Jan 21, 2016
- INFINEON TECHNOLOGIES AG
- Choo Tian Ooi
- G01 - MEASURING TESTING
Information Patent Application
PRIMER COMPOSITION, METHOD OF FORMING A PRIMER LAYER ON A SEMICONDU...
- Publication number 20150344730
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Swee Kah LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...