Chew Weng Leong

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating thin integrated circuit units
- Patent number 6,468,831
- Issue date Oct 22, 2002
- Texas Instruments Incorporated
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked double sided integrated circuit package
- Patent number 6,274,929
- Issue date Aug 14, 2001
- Texas Instruments Incorporated
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin chip-size integrated circuit package
- Patent number 6,091,140
- Issue date Jul 18, 2000
- Texas Instruments Incorporated
- Tuck Fook Toh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thin integrated circuit unit
- Publication number 20020000648
- Publication date Jan 3, 2002
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS