Chew Yeek LAU

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Muar, MY

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Patents Applicationslast 30 patents

Information Patent Application
Adaptive Flip Chip Bonding for Semiconductor Packages
- Publication number 20240213035
- Publication date Jun 27, 2024
- INFINEON TECHNOLOGIES AG
- Chew Yeek Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PACKAGE BY SOLDERABLE OR SINTERABLE METALLIC CONNECTI...
- Publication number 20230335516
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Chee Yang NG
- H01 - BASIC ELECTRIC ELEMENTS