Chi-Chang LIAO

Person

Pingtung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-level packaging sensing device and method for forming the same
- Patent number 10,140,498
- Issue date Nov 27, 2018
- Xintec Inc.
- Tsang-Yu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photosensitive module and method for forming the same
- Patent number 9,978,788
- Issue date May 22, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive module and method for forming the same
- Patent number 9,966,400
- Issue date May 8, 2018
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale sensing chip package
- Patent number 9,853,074
- Issue date Dec 26, 2017
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing module and method for forming the same
- Patent number 9,711,425
- Issue date Jul 18, 2017
- Xintec Inc.
- Shu-Ming Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package including recess in side edge
- Patent number 9,620,431
- Issue date Apr 11, 2017
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,355,975
- Issue date May 31, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP SCALE SENSING CHIP PACKAGE
- Publication number 20170213865
- Publication date Jul 27, 2017
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170117242
- Publication date Apr 27, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20170116458
- Publication date Apr 27, 2017
- XINTEC INC.
- Tsang-Yu LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSING MODULE AND METHOD FOR FORMING THE SAME
- Publication number 20170053848
- Publication date Feb 23, 2017
- XINTEC INC.
- Shu-Ming CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSING DEVICE
- Publication number 20160351607
- Publication date Dec 1, 2016
- XINTEC INC.
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160351608
- Publication date Dec 1, 2016
- XINTEC INC.
- Yu-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME
- Publication number 20160218129
- Publication date Jul 28, 2016
- XINTEC INC.
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME
- Publication number 20160218133
- Publication date Jul 28, 2016
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME
- Publication number 20160190353
- Publication date Jun 30, 2016
- XINTEC INC.
- Chi-Chang LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150228557
- Publication date Aug 13, 2015
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332969
- Publication date Nov 13, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS

Chi-Chang LIAO

Person

Patents Grantslast 30 patents

Wafer-level packaging sensing device and method for forming the same

Photosensitive module and method for forming the same

Photosensitive module and method for forming the same

Chip scale sensing chip package

Sensing module and method for forming the same

Chip package including recess in side edge

Chip package and method for forming the same

Patents Applicationslast 30 patents

CHIP SCALE SENSING CHIP PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SENSING DEVICE AND METHOD FOR FORMING THE SAME

SENSING MODULE AND METHOD FOR FORMING THE SAME

IMAGE SENSING DEVICE

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME

PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME

PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME