Chi-Chen Li

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor package unit of surface mount technology includ...
- Patent number 12,148,675
- Issue date Nov 19, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing side wettable package
- Patent number 11,916,030
- Issue date Feb 27, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package having a conductiv...
- Patent number 11,848,254
- Issue date Dec 19, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package element
- Patent number 11,664,345
- Issue date May 30, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabricating method of the same
- Patent number 11,594,425
- Issue date Feb 28, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a conductive pad with an anchor flange
- Patent number 11,562,947
- Issue date Jan 24, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side wettable package
- Patent number 11,387,203
- Issue date Jul 12, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIDE-WETTABLE SEMICONDUCTOR PACKAGE DEVICE WITH HEAT DISSIPATION SU...
- Publication number 20240355716
- Publication date Oct 24, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATIVE SEMICONDUCTOR PACKAGE
- Publication number 20240355703
- Publication date Oct 24, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF
- Publication number 20240128185
- Publication date Apr 18, 2024
- PANJIT INTERNATIONAL INC.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...
- Publication number 20240120241
- Publication date Apr 11, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUCTION ASSISTANCE DEVICE
- Publication number 20240112943
- Publication date Apr 4, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE UNIT
- Publication number 20240030155
- Publication date Jan 25, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS
- Publication number 20230402515
- Publication date Dec 14, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDERABLE SIDEWALL
- Publication number 20230395465
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGING UNIT
- Publication number 20230395469
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED COMPONENT WITH COMPOSITE PIN STRUCTURE AND MANUFACTURING M...
- Publication number 20230326833
- Publication date Oct 12, 2023
- PANJIT INTERNATIONAL INC.
- Yung-Hui WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELEMENT
- Publication number 20220406750
- Publication date Dec 22, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD FOR WAFER LEVEL SEMICONDUCTOR PACKAGE DEVICE AND...
- Publication number 20220406620
- Publication date Dec 22, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package Unit of Surface Mount Technology and Ma...
- Publication number 20220344228
- Publication date Oct 27, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SIDE WETTABLE PACKAGE
- Publication number 20220246561
- Publication date Aug 4, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220157707
- Publication date May 19, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING A CONDUCTIV...
- Publication number 20220122904
- Publication date Apr 21, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE WETTABLE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220077086
- Publication date Mar 10, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220005749
- Publication date Jan 6, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATING METHOD OF THE SAME
- Publication number 20210225662
- Publication date Jul 22, 2021
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MACHINE LEARNING DEPLOYMENT
- Publication number 20210064990
- Publication date Mar 4, 2021
- United Smart Electronics Corporation
- Chih-Wei HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROJECTED CAPACITIVE TOUCH PANEL AND FABRICATION METHOD THEREOF
- Publication number 20120032898
- Publication date Feb 9, 2012
- ARIMA DISPLAY CORPORATION
- Chi-Chen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROJECTIVE-CAPACITIVE TOUCH PANEL AND FABRICATION METHOD THEREOF
- Publication number 20110063232
- Publication date Mar 17, 2011
- ARIMA DISPLAY CORPORATION
- Chi-Chen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fixed collision rate back off methods and systems
- Publication number 20020163929
- Publication date Nov 7, 2002
- Chi-Peng Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Chi-Chen Li

Person

Patents Grantslast 30 patents

Power semiconductor package unit of surface mount technology includ...

Method for manufacturing side wettable package

Method for manufacturing a semiconductor package having a conductiv...

Semiconductor package element

Semiconductor package structure and fabricating method of the same

Semiconductor package having a conductive pad with an anchor flange

Side wettable package

Patents Applicationslast 30 patents

SIDE-WETTABLE SEMICONDUCTOR PACKAGE DEVICE WITH HEAT DISSIPATION SU...

HEAT DISSIPATIVE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF

PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...

DIE SUCTION ASSISTANCE DEVICE

WAFER LEVEL CHIP SCALE PACKAGE UNIT

METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS

SEMICONDUCTOR PACKAGE WITH SOLDERABLE SIDEWALL

THIN SEMICONDUCTOR PACKAGING UNIT

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

PACKAGED COMPONENT WITH COMPOSITE PIN STRUCTURE AND MANUFACTURING M...

SEMICONDUCTOR PACKAGE ELEMENT

FABRICATING METHOD FOR WAFER LEVEL SEMICONDUCTOR PACKAGE DEVICE AND...

Power Semiconductor Package Unit of Surface Mount Technology and Ma...

METHOD FOR MANUFACTURING SIDE WETTABLE PACKAGE

THIN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING A CONDUCTIV...

SIDE WETTABLE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATING METHOD OF THE SAME

METHOD FOR MACHINE LEARNING DEPLOYMENT

PROJECTED CAPACITIVE TOUCH PANEL AND FABRICATION METHOD THEREOF

PROJECTIVE-CAPACITIVE TOUCH PANEL AND FABRICATION METHOD THEREOF

Fixed collision rate back off methods and systems