Chi Cheng Pan

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with bumps and method for manufacturing the same
- Patent number 7,012,334
- Issue date Mar 14, 2006
- Advanced Semiconductor Engineering, Inc.
- Chih Chiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and testing method for the same
- Patent number 6,768,332
- Issue date Jul 27, 2004
- Advanced Semiconductor Engineering Inc.
- Yueh Lung Lin
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor chip with bumps and method for manufacturing the same
- Publication number 20050035451
- Publication date Feb 17, 2005
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Chih Chiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semicondutor wafer device
- Publication number 20040032009
- Publication date Feb 19, 2004
- Advanced Semiconductor Engineering, Inc.
- Yao-Shin Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and testing method for the same
- Publication number 20040021479
- Publication date Feb 5, 2004
- Advanced Semiconductor Engineering, Inc.
- Yueh Lung Lin
- G01 - MEASURING TESTING