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Chi Chuen Chaw
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Hong Kong, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Flip chip bonding tool
Patent number
7,458,495
Issue date
Dec 2, 2008
ASM Assembly Automation LTD
Ran Fu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Coating for enhancing adhesion of molding compound to semiconductor...
Patent number
7,329,617
Issue date
Feb 12, 2008
ASM Assembly Automation LTD
Jianxiong Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Coating for enhancing adhesion of molding compound to semiconductor...
Publication number
20060131720
Publication date
Jun 22, 2006
Jianxiong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip chip bonding tool
Publication number
20060076391
Publication date
Apr 13, 2006
ASM Assembly Automation Ltd.
Ran Fu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR