Chi-Chun Po

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New Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,641,720
- Issue date May 2, 2023
- Unimicron Technology Corp.
- Pei-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 11,631,626
- Issue date Apr 18, 2023
- Unimicron Technology Corp.
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 11,337,303
- Issue date May 17, 2022
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package carrier and package structure
- Patent number 10,881,006
- Issue date Dec 29, 2020
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20220159824
- Publication date May 19, 2022
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220108934
- Publication date Apr 7, 2022
- Unimicron Technology Corp.
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220095464
- Publication date Mar 24, 2022
- Unimicron Technology Corp.
- Pei-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20210014963
- Publication date Jan 14, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CARRIER AND PACKAGE STRUCTURE
- Publication number 20200329565
- Publication date Oct 15, 2020
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR