Chi Fung Chan

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Kwai Chung, CN

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method of placing solder balls onto a substrate
- Patent number 6,766,938
- Issue date Jul 27, 2004
- ASM Assembly Automation Ltd.
- Chi Wah Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and method of placing solder balls onto a substrate
- Publication number 20030127501
- Publication date Jul 10, 2003
- ASM Automation Assembly Ltd
- Chi Wah Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR