Chi Hoo Wan

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device with interior polygonal pads
- Patent number 10,056,343
- Issue date Aug 21, 2018
- Nexperia B.V.
- Roelf A. J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with interior polygonal pads
- Patent number 9,269,690
- Issue date Feb 23, 2016
- NXP B.V.
- Roelf A. J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS
- Publication number 20160118357
- Publication date Apr 28, 2016
- NXP B.V.
- Roelf A.J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS
- Publication number 20150162298
- Publication date Jun 11, 2015
- NXP B.V.
- Roelf A.J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS