Chi-Hwa Tsang

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive cap-based approaches for conductive via fabrication and...
- Patent number 11,417,567
- Issue date Aug 16, 2022
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless filled conductive structures
- Patent number 9,123,706
- Issue date Sep 1, 2015
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling narrow and high aspect ratio openings with electroless depo...
- Patent number 7,622,382
- Issue date Nov 24, 2009
- Intel Corporation
- Shaestagir Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Filling narrow and high aspect ratio openings using electroless dep...
- Patent number 7,432,200
- Issue date Oct 7, 2008
- Intel Corporation
- Shaestagir Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of surface treatment for electrolytic and elec...
- Patent number 7,070,687
- Issue date Jul 4, 2006
- Intel Corporation
- Vinay B. Chikarmane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trench isolation with planar topography and method of fabrication
- Patent number 5,358,891
- Issue date Oct 25, 1994
- Intel Corporation
- Chi-Hwa Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic plasma etching of tungsten
- Patent number 4,713,141
- Issue date Dec 15, 1987
- Intel Corporation
- Chi-Hwa Tsang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pattern delineation of vertical load resistor
- Patent number 4,690,728
- Issue date Sep 1, 1987
- Intel Corporation
- Chi-Hwa Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching of silicon using fluorinated gas mixtures
- Patent number 4,666,555
- Issue date May 19, 1987
- Intel Corporation
- Chi-Hwa Tsang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE CAP-BASED APPROACHES FOR CONDUCTIVE VIA FABRICATION AND...
- Publication number 20190363008
- Publication date Nov 28, 2019
- Intel Corporation
- Florian GSTREIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS FILLED CONDUCTIVE STRUCTURES
- Publication number 20150371949
- Publication date Dec 24, 2015
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS FILLED CONDUCTIVE STRUCTURES
- Publication number 20130270703
- Publication date Oct 17, 2013
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPLACEMENT METAL GATE FILL
- Publication number 20110147831
- Publication date Jun 23, 2011
- Joseph M. Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filling narrow and high aspect ratio openings with electroless depo...
- Publication number 20070232044
- Publication date Oct 4, 2007
- Shaestagir Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Filling narrow and high aspect ratio openings using electroless dep...
- Publication number 20070141826
- Publication date Jun 21, 2007
- Intel Corporation
- Shaestagir Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method of surface treatment for electrolytic and elec...
- Publication number 20030034251
- Publication date Feb 20, 2003
- Vinay B. Chikarmane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Chi-Hwa Tsang

Person

Patents Grantslast 30 patents

Conductive cap-based approaches for conductive via fabrication and...

Electroless filled conductive structures

Filling narrow and high aspect ratio openings with electroless depo...

Filling narrow and high aspect ratio openings using electroless dep...

Apparatus and method of surface treatment for electrolytic and elec...

Trench isolation with planar topography and method of fabrication

Anisotropic plasma etching of tungsten

Pattern delineation of vertical load resistor

Plasma etching of silicon using fluorinated gas mixtures

Patents Applicationslast 30 patents

CONDUCTIVE CAP-BASED APPROACHES FOR CONDUCTIVE VIA FABRICATION AND...

ELECTROLESS FILLED CONDUCTIVE STRUCTURES

ELECTROLESS FILLED CONDUCTIVE STRUCTURES

METHOD FOR REPLACEMENT METAL GATE FILL

Filling narrow and high aspect ratio openings with electroless depo...

Filling narrow and high aspect ratio openings using electroless dep...

Apparatus and method of surface treatment for electrolytic and elec...