Chi-Hwang Tai

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor component, package structure and manufacturing method...
- Patent number 11,043,482
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component, package structure and manufacturing method...
- Patent number 10,672,754
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component, package structure and manufacturing method...
- Patent number 10,319,707
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR COMPONENT, PACKAGE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20200294984
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT, PACKAGE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20190312022
- Publication date Oct 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT, PACKAGE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20190096867
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS