Chi Hyeon Jeong

Person

  • Suwon-si, KR

Patents Grantslast 30 patents

  • Information Patent Grant

    Multilayer capacitor and board having the same embedded therein

    • Patent number 12,211,649
    • Issue date Jan 28, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Min Cheol Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Printed circuit board

    • Patent number 11,812,552
    • Issue date Nov 7, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Chul Mun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Package structure

    • Patent number 11,488,942
    • Issue date Nov 1, 2022
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Chi Hyeon Jeong
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250098067
    • Publication date Mar 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250081343
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ACTUATOR FOR OPTICAL IMAGING STABILIZATION AND CAMERA MODULE INCLUD...

    • Publication number 20250056119
    • Publication date Feb 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Yong KIM
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20250046725
    • Publication date Feb 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seok Hwan KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250016917
    • Publication date Jan 9, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Uk LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAPACITOR COMPONENT

    • Publication number 20240413056
    • Publication date Dec 12, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD

    • Publication number 20240387344
    • Publication date Nov 21, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD

    • Publication number 20240379513
    • Publication date Nov 14, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240332199
    • Publication date Oct 3, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240332208
    • Publication date Oct 3, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR COMPONENT AND CAPACITOR-EMBEDDED SUBSTRATE

    • Publication number 20230343519
    • Publication date Oct 26, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Jong LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CAPACITOR AND BOARD HAVING THE SAME EMBEDDED THEREIN

    • Publication number 20230307179
    • Publication date Sep 28, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Min Cheol PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20220192014
    • Publication date Jun 16, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Chul Mun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE STRUCTURE

    • Publication number 20220157794
    • Publication date May 19, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon Jeong
    • H01 - BASIC ELECTRIC ELEMENTS