Chi Hyeon Jeong

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 11,812,552
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chul Mun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 11,488,942
- Issue date Nov 1, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Hyeon Jeong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR COMPONENT AND CAPACITOR-EMBEDDED SUBSTRATE
- Publication number 20230343519
- Publication date Oct 26, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Sang Jong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR AND BOARD HAVING THE SAME EMBEDDED THEREIN
- Publication number 20230307179
- Publication date Sep 28, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Min Cheol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220192014
- Publication date Jun 16, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chul Mun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220157794
- Publication date May 19, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon Jeong
- H01 - BASIC ELECTRIC ELEMENTS