Chi-Liang Pan

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Hsinchu County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,276,545
- Issue date Apr 30, 2019
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure having redistribution layer
- Patent number 10,177,077
- Issue date Jan 8, 2019
- Powertech Technology Inc.
- Chi-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN INTERNAL HEAT SINK AND METHOD FOR MAN...
- Publication number 20200312734
- Publication date Oct 1, 2020
- Powertech Technology Inc.
- Ting-Feng Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE HAVING REDISTRIBUTION LAYER
- Publication number 20180301396
- Publication date Oct 18, 2018
- Powertech Technology Inc.
- Chi-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS