Chi Lu

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,749,532
- Issue date Sep 5, 2023
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect for semiconductor device
- Patent number 11,508,617
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond-like carbon as mandrel
- Patent number 10,954,129
- Issue date Mar 23, 2021
- Applied Materials, Inc.
- Takehito Koshizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20230045689
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220359224
- Publication date Nov 10, 2022
- Hao JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20210125864
- Publication date Apr 29, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond-Like Carbon As Mandrel
- Publication number 20180358229
- Publication date Dec 13, 2018
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS