Chi-Mon Chen

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including silane based adhesion promoter and m...
- Patent number 10,916,486
- Issue date Feb 9, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder resist layer structures for terminating de-featured componen...
- Patent number 10,658,198
- Issue date May 19, 2020
- Intel Corporation
- Li-Sheng Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder resist layer structures for terminating de-featured componen...
- Patent number 10,244,632
- Issue date Mar 26, 2019
- Intel Corporation
- Li-Sheng Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate for semiconductor packaging
- Patent number 9,788,416
- Issue date Oct 10, 2017
- Intel Corporation
- Wei-Lun Kane Jen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLATFORM POWER INTEGRITY DESIGN INCLUDING PACKAGE STANDARD POWER IN...
- Publication number 20210327801
- Publication date Oct 21, 2021
- Xing Jian Cai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20190355642
- Publication date Nov 21, 2019
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...
- Publication number 20190181017
- Publication date Jun 13, 2019
- Intel Corporation
- Li-Sheng Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER RESIST LAYER STRUCTURES FOR TERMINATING DE-FEATURED COMPONEN...
- Publication number 20180255640
- Publication date Sep 6, 2018
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE FOR SEMICONDUCTOR PACKAGING
- Publication number 20160329274
- Publication date Nov 10, 2016
- Intel Corporation
- Wei-Lun Kane Jen
- H01 - BASIC ELECTRIC ELEMENTS