Chi Ping HUNG

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Bond head for thermal compression die bonding
- Patent number 9,281,290
- Issue date Mar 8, 2016
- ASM Technology Singapore Pte. Ltd.
- Kin Yik Hung
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
BOND HEAD FOR THERMAL COMPRESSION DIE BONDING
- Publication number 20140027068
- Publication date Jan 30, 2014
- Kin Yik HUNG
- B32 - LAYERED PRODUCTS