Chi Po Chong

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Tseung Kwan O, HK

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Patents Grantslast 30 patents

Information Patent Grant
Die bonder and a method of cleaning a bond collet
- Patent number 9,318,362
- Issue date Apr 19, 2016
- ASM Technology Singapore Pte. Ltd.
- Mei Po Leung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal die detachment apparatus
- Patent number 8,470,130
- Issue date Jun 25, 2013
- ASM Assembly Automation LTD
- Chi Ming Chong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device for thin die detachment and pick-up
- Patent number 8,141,612
- Issue date Mar 27, 2012
- ASM Assembly Automation LTD
- Man Wai Chan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Control and monitoring system for thin die detachment and pick-up
- Patent number 8,092,645
- Issue date Jan 10, 2012
- ASM Assembly Automation LTD
- Siu Ping Yip
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Capillary holder
- Patent number 7,100,812
- Issue date Sep 5, 2006
- ASM Technology Singapore Pte. Ltd.
- Bao Nian Zhai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDER AND A METHOD OF CLEANING A BOND COLLET
- Publication number 20150187617
- Publication date Jul 2, 2015
- Mei Po LEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL AND MONITORING SYSTEM FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20110192547
- Publication date Aug 11, 2011
- Siu Ping YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL DIE DETACHMENT APPARATUS
- Publication number 20110088845
- Publication date Apr 21, 2011
- Chi Ming CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20100252205
- Publication date Oct 7, 2010
- Man Wai CHAN
- H01 - BASIC ELECTRIC ELEMENTS