Chi-Shen Ho

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level mounting frame for ball grid array packaging, and metho...
- Patent number 7,208,344
- Issue date Apr 24, 2007
- Aptos Corporation
- Chi Shen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible multi-chip module and method of making the same
- Patent number 7,141,875
- Issue date Nov 28, 2006
- Aptos Corp
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale integration packaging and method of making and using th...
- Patent number 7,078,272
- Issue date Jul 18, 2006
- Aptos Corporation
- Chi-Shen Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer scale integration packaging and method of making and using th...
- Publication number 20060063311
- Publication date Mar 23, 2006
- Aptos Corporation
- Chi-Shen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level mounting frame with passive components integration for...
- Publication number 20060001145
- Publication date Jan 5, 2006
- Aptos Corporation
- Chi-Shen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible multi-chip module and method of making the same
- Publication number 20050227412
- Publication date Oct 13, 2005
- Aptos Corporation
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level mounting frame for ball grid array packaging, and metho...
- Publication number 20050224968
- Publication date Oct 13, 2005
- Aptos Corporation
- Chi Shen Ho
- H01 - BASIC ELECTRIC ELEMENTS