Chi-won Hwang

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Carbon nanotube-reinforced solder caps, and chip packages and syste...
- Patent number 8,391,016
- Issue date Mar 5, 2013
- Intel Corporation
- Chi-won Hwang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for making multi-chip packaging using an interposer
- Patent number 8,387,240
- Issue date Mar 5, 2013
- Intel Corporation
- Sriram Muthukumar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of forming C4 round dimple metal stud bumps for fine pitch...
- Patent number 7,952,203
- Issue date May 31, 2011
- Intel Corporation
- Chi-won Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging using an interposer such as a silicon based in...
- Patent number 7,882,628
- Issue date Feb 8, 2011
- Intel Corporation
- Sriram Muthukumar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-chip packaging using an interposer with through-vias
- Patent number 7,841,080
- Issue date Nov 30, 2010
- Intel Corporation
- Sriram Muthukumar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of assembling carbon nanotube reinforced solder caps
- Patent number 7,600,667
- Issue date Oct 13, 2009
- Intel Corporation
- Chi-won Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered metallic thermal interface materials for microelectronic c...
- Patent number 7,535,099
- Issue date May 19, 2009
- Intel Corporation
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal Carbon Nanotubes by Vertical Growth and Rolling
- Patent number 7,514,116
- Issue date Apr 7, 2009
- Intel Corporation
- Devendra Natekar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotube reinforced metallic layer
- Patent number 7,268,077
- Issue date Sep 11, 2007
- Intel Corporation
- Chi-Won Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING HIGH DENSITY METAL WIRING FOR FINE LINE AND SPAC...
- Publication number 20170004978
- Publication date Jan 5, 2017
- Intel Corporation
- Chi-won Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...
- Publication number 20110067236
- Publication date Mar 24, 2011
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon nanotube-reinforced solder caps, methods of assembling same,...
- Publication number 20100084764
- Publication date Apr 8, 2010
- Chi-won Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming C4 metal stud bump for fine pitch packaging appl...
- Publication number 20100052159
- Publication date Mar 4, 2010
- Chi-won Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING...
- Publication number 20090072013
- Publication date Mar 19, 2009
- DEVENDRA NATEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU CHIP ATTACHMENT USING SELF-ORGANIZING SOLDER
- Publication number 20090057378
- Publication date Mar 5, 2009
- Chi-Won Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...
- Publication number 20080295325
- Publication date Dec 4, 2008
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...
- Publication number 20080295329
- Publication date Dec 4, 2008
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE-REINFORCED SOLDER CAPS, METHODS OF ASSEMBLING SAME...
- Publication number 20080078813
- Publication date Apr 3, 2008
- Chi-won Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintered metallic thermal interface materials for microelectronic c...
- Publication number 20080073776
- Publication date Mar 27, 2008
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder composition having dispersoid particles for increased creep...
- Publication number 20070227627
- Publication date Oct 4, 2007
- Daewoong Suh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nano-scale particle paste for wiring microelectronic devices using...
- Publication number 20070152194
- Publication date Jul 5, 2007
- Intel Corporation
- Devendra Natekar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carbon nanotube reinforced metallic layer
- Publication number 20070128883
- Publication date Jun 7, 2007
- Intel Corporation
- Chi-Won Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chi-won Hwang

Person

Patents Grantslast 30 patents

Carbon nanotube-reinforced solder caps, and chip packages and syste...

Methods for making multi-chip packaging using an interposer

Methods of forming C4 round dimple metal stud bumps for fine pitch...

Multi-chip packaging using an interposer such as a silicon based in...

Multi-chip packaging using an interposer with through-vias

Method of assembling carbon nanotube reinforced solder caps

Sintered metallic thermal interface materials for microelectronic c...

Horizontal Carbon Nanotubes by Vertical Growth and Rolling

Carbon nanotube reinforced metallic layer

Patents Applicationslast 30 patents

METHODS OF FORMING HIGH DENSITY METAL WIRING FOR FINE LINE AND SPAC...

MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...

Carbon nanotube-reinforced solder caps, methods of assembling same,...

Methods of forming C4 metal stud bump for fine pitch packaging appl...

NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING...

IN-SITU CHIP ATTACHMENT USING SELF-ORGANIZING SOLDER

MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...

MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...

CARBON NANOTUBE-REINFORCED SOLDER CAPS, METHODS OF ASSEMBLING SAME...

Sintered metallic thermal interface materials for microelectronic c...

Solder composition having dispersoid particles for increased creep...

Nano-scale particle paste for wiring microelectronic devices using...

Carbon nanotube reinforced metallic layer