TREA

Chi-Yi Wu

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  • Milpitas, CA, US
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Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20240047313
    • Publication date Feb 8, 2024
    • Integrated Silicon Solution Inc.
    • Cheng-Fu YU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20220246501
    • Publication date Aug 4, 2022
    • Integrated Silicon Solution Inc.
    • Cheng-Fu YU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20210305136
    • Publication date Sep 30, 2021
    • Integrated Silicon Solution Inc.
    • Cheng-Fu YU
    • H01 - BASIC ELECTRIC ELEMENTS