Chi Yuan CHU

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of operating transport system
- Patent number 11,854,844
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yuan Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for unpacking semiconductor wafer container
- Patent number 11,605,553
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fu-Hsien Li
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of operating transport system
- Patent number 11,367,637
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yuan Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for unpacking semiconductor wafer container
- Patent number 10,840,121
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fu-Hsien Li
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF OPERATING TRANSPORT SYSTEM
- Publication number 20220328330
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yuan CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF OPERATING TRANSPORT SYSTEM
- Publication number 20210249297
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yuan CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR UNPACKING SEMICONDUCTOR WAFER CONTAINER
- Publication number 20210082736
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Hsien LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR UNPACKING SEMICONDUCTOR WAFER CONTAINER
- Publication number 20180118398
- Publication date May 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Hsien LI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL