Chia Cheng Chin

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Nucleation-free gap fill ALD process
- Patent number 11,289,374
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten deposition without barrier layer
- Patent number 10,854,461
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of lowering wordline resistance
- Patent number 10,854,511
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Yihong Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Tungsten deposition without barrier layer
- Patent number 10,468,263
- Issue date Nov 5, 2019
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLOW GUIDE STRUCTURES AND HEAT SHIELD STRUCTURES, AND RELATED METHO...
- Publication number 20240018658
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Zuoming ZHU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BATCH THERMAL PROCESS CHAMBER
- Publication number 20230230859
- Publication date Jul 20, 2023
- Applied Materials, Inc.
- Adel George TANNOUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC EPITAXIAL GROWTH
- Publication number 20220319844
- Publication date Oct 6, 2022
- Applied Materials, Inc.
- Chia Cheng CHIN
- C30 - CRYSTAL GROWTH
Information Patent Application
SELECTIVE METHODS FOR FABRICATING DEVICES AND STRUCTURES
- Publication number 20220310390
- Publication date Sep 29, 2022
- Yi-Chiau HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER BODY FEEDTHROUGH FOR IN CHAMBER RESISTIVE HEATING ELEMENT
- Publication number 20220254634
- Publication date Aug 11, 2022
- Applied Materials, Inc.
- Brian Hayes BURROWS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Nucleation-Free Gap Fill ALD Process
- Publication number 20220172989
- Publication date Jun 2, 2022
- Applied Materials, Inc.
- Yihong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Tungsten Deposition Without Barrier Layer
- Publication number 20200027738
- Publication date Jan 23, 2020
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nucleation-Free Gap Fill ALD Process
- Publication number 20190371662
- Publication date Dec 5, 2019
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Lowering Wordline Resistance
- Publication number 20180350606
- Publication date Dec 6, 2018
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tungsten Deposition Without Barrier Layer
- Publication number 20180247821
- Publication date Aug 30, 2018
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Chia Cheng Chin

Person

Patents Grantslast 30 patents

Nucleation-free gap fill ALD process

Tungsten deposition without barrier layer

Methods of lowering wordline resistance

Tungsten deposition without barrier layer

Patents Applicationslast 30 patents

FLOW GUIDE STRUCTURES AND HEAT SHIELD STRUCTURES, AND RELATED METHO...

BATCH THERMAL PROCESS CHAMBER

ANISOTROPIC EPITAXIAL GROWTH

SELECTIVE METHODS FOR FABRICATING DEVICES AND STRUCTURES

CHAMBER BODY FEEDTHROUGH FOR IN CHAMBER RESISTIVE HEATING ELEMENT

Nucleation-Free Gap Fill ALD Process

Tungsten Deposition Without Barrier Layer

Nucleation-Free Gap Fill ALD Process

Methods Of Lowering Wordline Resistance

Tungsten Deposition Without Barrier Layer