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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with hybrid mold layers
- Patent number 12,288,740
- Issue date Apr 29, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for automatically switching to a channel for transmission on...
- Patent number 9,313,621
- Issue date Apr 12, 2016
- Motorola Solutions, Inc.
- Mun Yew Tham
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH STACKED MEMORY DEVICES
- Publication number 20230163101
- Publication date May 25, 2023
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABANDONED OBJECT DETECTION
- Publication number 20220012490
- Publication date Jan 13, 2022
- Charmaine Rui Qin Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HYBRID MOLD LAYERS
- Publication number 20210335698
- Publication date Oct 28, 2021
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GESTURE EMBEDDED VIDEO
- Publication number 20180307318
- Publication date Oct 25, 2018
- Intel Corporation
- Chia Chuan Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR AUTOMATICALLY SWITCHING TO A CHANNEL FOR TRANSMISSION ON...
- Publication number 20150296351
- Publication date Oct 15, 2015
- MOTOROLA SOLUTIONS, INC.
- MUN YEW THAM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE