CHIA-CHUN MIAO

Person

TAICHUNG CITY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 12,218,035
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,985,117
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,720,495
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,510,689
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 10,347,563
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit underfill scheme
- Patent number 10,269,588
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,163,846
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,157,900
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball protection in packages
- Patent number 10,049,990
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,037,959
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,953,966
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip scale package and manufacturing method thereof
- Patent number 9,941,240
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by so...
- Patent number 9,806,045
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 9,698,079
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 9,659,839
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,653,341
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package alignment structure and method of forming same
- Patent number 9,627,325
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 9,559,071
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,543,373
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,472,523
- Issue date Oct 18, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer having a defined through via pattern
- Patent number 9,460,989
- Issue date Oct 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit underfill scheme
- Patent number 9,355,924
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,337,154
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,263,405
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bump adjustment and manufacturing method...
- Patent number 9,184,143
- Issue date Nov 10, 2015
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20220230940
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Protection in Packages
- Publication number 20200118947
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20190333841
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps
- Publication number 20190123017
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Protection in Packages
- Publication number 20180337144
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTING SEMICONDUCTOR COMPONENTS
- Publication number 20180211935
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180061798
- Publication date Mar 1, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20170256477
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps
- Publication number 20170141073
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Manufacturing Method Thereof
- Publication number 20170098640
- Publication date Apr 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170018519
- Publication date Jan 19, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Underfill Scheme
- Publication number 20160254169
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20160133618
- Publication date May 12, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160064338
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150364376
- Publication date Dec 17, 2015
- TAIWAN SEMICONDUCTOR MANUFACTURING COMAPNY LTD.
- TSUNG-YUAN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150255273
- Publication date Sep 10, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL PROTECTION IN PACKAGES
- Publication number 20150255406
- Publication date Sep 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150200173
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20150194400
- Publication date Jul 9, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20150162288
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20150162291
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150108635
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-WEI LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150061116
- Publication date Mar 5, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150035161
- Publication date Feb 5, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150008575
- Publication date Jan 8, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING HYBRID BONDING STRUCTURES WITH ELONGATED BUMPS
- Publication number 20150001704
- Publication date Jan 1, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Lin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Alignment Structure and Method of Forming Same
- Publication number 20140252657
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer Having a Defined Through Via Pattern
- Publication number 20140162405
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Underfill Scheme
- Publication number 20140117555
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS

CHIA-CHUN MIAO

Person

Patents Grantslast 30 patents

Barrier structures between external electrical connectors

Methods of manufacturing a semiconductor device including a joint a...

Barrier structures between external electrical connectors

Surface mounting semiconductor components

Solder ball protection in packages

Interconnection structure including a metal post encapsulated by a...

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor device and manufacturing method thereof

Solder ball protection in packages

Barrier structures between external electrical connectors

Integrated circuit underfill scheme

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor structure and manufacturing method thereof

Solder ball protection in packages

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of forming the same

Semiconductor chip scale package and manufacturing method thereof

Interconnection structure including a metal post encapsulated by so...

Barrier structures between external electrical connectors

Barrier structures between external electrical connectors

Semiconductor structure and manufacturing method thereof

Package alignment structure and method of forming same

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Interposer having a defined through via pattern

Integrated circuit underfill scheme

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device with bump adjustment and manufacturing method...

Patents Applicationslast 30 patents

Barrier Structures Between External Electrical Connectors

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Solder Ball Protection in Packages

Barrier Structures Between External Electrical Connectors

Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps

Solder Ball Protection in Packages

SURFACE MOUNTING SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Barrier Structures Between External Electrical Connectors

Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps

Semiconductor Structure and Manufacturing Method Thereof

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Underfill Scheme

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SOLDER BALL PROTECTION IN PACKAGES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Barrier Structures Between External Electrical Connectors

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MECHANISMS FOR FORMING HYBRID BONDING STRUCTURES WITH ELONGATED BUMPS

Package Alignment Structure and Method of Forming Same

Interposer Having a Defined Through Via Pattern

Integrated Circuit Underfill Scheme