Chia-Feng HSIAO

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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer backside defect detection method and wafer backside defect de...
- Patent number 11,821,847
- Issue date Nov 21, 2023
- United Microelectronics Corp.
- Cheng-Hsien Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Automatic detection method and automatic detection system for detec...
- Patent number 11,644,427
- Issue date May 9, 2023
- United Microelectronics Corp.
- Chia-Feng Hsiao
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER BACKSIDE DEFECT DETECTION METHOD AND WAFER BACKSIDE DEFECT DE...
- Publication number 20230024259
- Publication date Jan 26, 2023
- United Microelectronics Corp.
- Cheng-Hsien CHEN
- G01 - MEASURING TESTING
Information Patent Application
AUTOMATIC DETECTION METHOD AND AUTOMATIC DETECTION SYSTEM FOR DETEC...
- Publication number 20220128485
- Publication date Apr 28, 2022
- United Microelectronics Corp.
- Chia-Feng HSIAO
- G01 - MEASURING TESTING