Chia Hao SUNG

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,973,039
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia-Hao Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,024,586
- Issue date Jun 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Chia-Hao Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,689,248
- Issue date Jun 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming Yen Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210288002
- Publication date Sep 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Chia-Hao SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200235056
- Publication date Jul 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Chia-Hao SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180265347
- Publication date Sep 20, 2018
- Advanced Semiconductor Engineering, Inc.
- Ming Yen LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY