Chia-Ken Leong

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Molded chip combination
- Patent number 10,510,721
- Issue date Dec 17, 2019
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED CHIP COMBINATION
- Publication number 20190051633
- Publication date Feb 14, 2019
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS