Chia-Liang CHUEH

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Chiayi City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Magnet module having epicyclic gearing system and method of use
- Patent number 9,305,754
- Issue date Apr 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Liang Chueh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target with reverse erosion profile surface and sputteri...
- Patent number 9,127,356
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Liang Chueh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing cu surface defects following cu ECP
- Patent number 6,863,796
- Issue date Mar 8, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Liang Chueh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
MAGNET MODULE HAVING EPICYCLIC GEARING SYSTEM AND METHOD OF USE
- Publication number 20140008213
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Liang CHUEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING TARGET WITH REVERSE EROSION PROFILE SURFACE AND SPUTTERI...
- Publication number 20130043120
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Liang CHUEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for Blocking I/O Interfaces of Computing Devices
- Publication number 20120289069
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Liang Chueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Adhesion of Films to Process Kits
- Publication number 20100089744
- Publication date Apr 15, 2010
- Chia-Liang Chueh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for reducing cu surface defects following cu ECP
- Publication number 20040004004
- Publication date Jan 8, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Liang Chueh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR