Chia-Liang Liao

Person

Yunlin County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 12,080,622
- Issue date Sep 3, 2024
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 11,670,567
- Issue date Jun 6, 2023
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming layout definition of semiconductor device
- Patent number 10,795,255
- Issue date Oct 6, 2020
- United Microelectronics Corp.
- Wei-Lun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,658,366
- Issue date May 19, 2020
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,535,610
- Issue date Jan 14, 2020
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS
- Publication number 20240047266
- Publication date Feb 8, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20230411343
- Publication date Dec 21, 2023
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING
- Publication number 20230268246
- Publication date Aug 24, 2023
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING
- Publication number 20220013430
- Publication date Jan 13, 2022
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING LAYOUT DEFINITION OF SEMICONDUCTOR DEVICE
- Publication number 20200105764
- Publication date Apr 2, 2020
- UNITED MICROELECTRONICS CORP.
- Wei-Lun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20190035743
- Publication date Jan 31, 2019
- UNITED MICROELECTRONICS CORP.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180315759
- Publication date Nov 1, 2018
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS

Chia-Liang Liao

Person

Patents Grantslast 30 patents

Semiconductor structure and method of wafer bonding

Semiconductor structure and method of wafer bonding

Method of forming layout definition of semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor structure

Patents Applicationslast 30 patents

METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING

SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING

METHOD OF FORMING LAYOUT DEFINITION OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME