Chia-Ling Kao

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for anisotropic control of selective silicon removal
- Patent number 10,170,336
- Issue date Jan 1, 2019
- Applied Materials, Inc.
- Zihui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for barrier layer removal
- Patent number 9,514,953
- Issue date Dec 6, 2016
- Applied Materials, Inc.
- Chia-Ling Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a dielectric barrier layer in a dual damascene...
- Patent number 9,299,577
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing a metal hardmask
- Patent number 9,006,106
- Issue date Apr 14, 2015
- Applied Materials, Inc.
- Chia-Ling Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an ultra low-k dielectric self-aligned via
- Patent number 8,992,792
- Issue date Mar 31, 2015
- Applied Materials, Inc.
- Chih-Yang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-k dielectric film
- Patent number 8,987,139
- Issue date Mar 24, 2015
- Applied Materials, Inc.
- Chia-Ling Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delicate dry clean
- Patent number 8,895,449
- Issue date Nov 25, 2014
- Applied Materials, Inc.
- Lina Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming ultra thin structures on a substrate
- Patent number 7,981,812
- Issue date Jul 19, 2011
- Applied Materials, Inc.
- Kang-Lie Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR ETCHING A DIELECTRIC BARRIER LAYER IN A DUAL DAMASCENE...
- Publication number 20150214101
- Publication date Jul 30, 2015
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BARRIER LAYER REMOVAL
- Publication number 20150140827
- Publication date May 21, 2015
- Applied Materials, Inc.
- Chia-Ling KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE PLASMA ANNEAL PROCESS FOR SUBLIMATIVE ETCH PROCESSES
- Publication number 20150064921
- Publication date Mar 5, 2015
- Applied Materials, Inc.
- Srinivas D. NEMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELICATE DRY CLEAN
- Publication number 20140342532
- Publication date Nov 20, 2014
- Applied Materials, Inc.
- Lina Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REMOVING A METAL HARDMASK
- Publication number 20140273496
- Publication date Sep 18, 2014
- Chia-Ling Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20140213060
- Publication date Jul 31, 2014
- Chia-Ling Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING AN ULTRA LOW-K DIELECTRIC SELF-ALIGNED VIA
- Publication number 20140024220
- Publication date Jan 23, 2014
- Chih-Yang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SUBSTRATE POLYMER REMOVAL
- Publication number 20090293907
- Publication date Dec 3, 2009
- Nancy Fung
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS OF FOR FORMING ULTRA THIN STRUCTURES ON A SUBSTRATE
- Publication number 20090035944
- Publication date Feb 5, 2009
- APPLIED MATERIALS, INC.
- Kang-Lie Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Chia-Ling Kao

Person

Patents Grantslast 30 patents

Methods for anisotropic control of selective silicon removal

Methods for barrier layer removal

Methods for etching a dielectric barrier layer in a dual damascene...

Method of removing a metal hardmask

Method of fabricating an ultra low-k dielectric self-aligned via

Method of patterning a low-k dielectric film

Delicate dry clean

Methods for forming ultra thin structures on a substrate

Patents Applicationslast 30 patents

METHODS FOR ETCHING A DIELECTRIC BARRIER LAYER IN A DUAL DAMASCENE...

METHODS FOR BARRIER LAYER REMOVAL

LOW TEMPERATURE PLASMA ANNEAL PROCESS FOR SUBLIMATIVE ETCH PROCESSES

DELICATE DRY CLEAN

METHOD OF REMOVING A METAL HARDMASK

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHOD OF FABRICATING AN ULTRA LOW-K DIELECTRIC SELF-ALIGNED VIA

METHOD OF SUBSTRATE POLYMER REMOVAL

METHODS OF FOR FORMING ULTRA THIN STRUCTURES ON A SUBSTRATE